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Brand Name : Seprays
Model Number : ZM330
Certification : CE
Place of Origin : China
MOQ : 1 set
Price : USD1500-32000
Payment Terms : L/C, T/T, Western Union, MoneyGram
Supply Ability : 500 sets per Month
Delivery Time : 30-45 days
Packaging Details : Vacuum packed in wooden cases
Keywords : PCB Laser Cutting Machine
Product Model : ZM330
Valid Cutting Area : 300*350mm
Advantage : High Efficient
Machine Dimensions : 1220(W)*1150(D)*1454(H) mm
Weight : 480kg
Materials : Aluminum
Functions : High Speed Spindle
V Groove 75L/Min PCB Laser Cutting Machine For GPS Device PDA
New Type V Groove Machine PCB Laser Cutting Machine Blade for GPS Device ZM330
PCB Laser Cutting Machine Description:
- Provide auto tool-change mechanism. Efficiency of operation is promoted significantly.
- Equipped with high-speed CCD vision alignment system in all series of products to
enhance the precision in cutting and efficiency in operation.
- Use high-speed spindle with small cutting stress to precisely cut PCB of any shape.
- Provide dual worktables for placing and cutting PCB in parallel to enhance the efficiency of operation.
- Patented dust collector with low noise and high efficiency. Easy to clean and maintain.
- Windows OS and window-based interface panel. Safe, stable, easy to learn and operate.
PCB Laser Cutting Machine Specification
| ITEM | ZM330 | 
| Valid Cutting Area | 300*350mm | 
| Cutting Function | Tweening to Line,L-Shape,U-shape,Circle,Arc | 
| Process Table | Dual Tables | 
| Repeat Precision | ±0.01mm | 
| Cutting Precision | ≦±0.05mm | 
| Max.Moving Speed | XY-axis:1000mm/s,Z-axis:500mm/s | 
| Max.Moving Trip | X:840Y:510Z:90mm | 
| Spindle Speed | MAX.60000rpm Adjustable | 
| Tool Chang Method | Has | 
| Tool Detection | Mechanism of Detecting Broken Milling Tool is Available(Optional) | 
| Cutting Speed | 0~100mm/s Adjustable | 
| Operation System | Windows10 | 
| Program Teaching Method | Intuitive Teaching by CCD Color Image Input | 
| Program Backup | USB | 
| Control Method | Precision Multi-axis Control System | 
| XYZ-Axis Driving Mode | AC Servo Motor | 
| Size of Millng Bit | 0.8~3.0mm | 
| Voltage | 2.2KW Single Phase 50/60HZ | 
| Pneumatic Pressure Requirement | 0.6Mpa ,75L/min | 
| Machine Size | 1220(W)*1150(D)*1454(H)mm | 
| Machine Weight | 480kg | 
| Dust Collector | TS200 | 
PCB Laser Cutting Machine APPLICATION
- Equipped with high efficient vision-aided position alignment system with high-speed CCD camera in all product series. Especially designed for high-precision and high-prodution PCB cutting process.
- Suitable for de-paneling small-sized PCBs for cell phone, car electronics, GPS device, PDA, and board card, etc.
- Can choose either standard fixture or customized fixture for PCB cutting to help increasing the production volume.
- Provide dual worktables so that placing and cutting PCB can be performed in parallel to minimize the waiting time.
Operation Panel
Operation interface is clear, friendly, and simple.Easy to learn and start quickly.
Functional items are clear and well categorized.Very easy to set the parameters for milling tool and fixture.
Provide four levels of authorization control according to user's job rank.
The "History Window" can display the historical records of operation.
Milling Tool Detection
Provide capability of detecting broken/dropped/reversed milling tool for auto tool-change.
Dual Worktables
Provide dual worktables so that placing and cutting PCB can be performed in parallel to minimize the waiting time and enhance the efficiency of operation.
The moving in and out of worktables are driven by precision screws. Has high speed and high precision.
Adding safety light curtain is available(optional).
Vision-Aided Position Calibration
Use computer vision with high-quality CCD to automatically position the mark points and enhance the accuracy of cutting.
Can edit the path-planning program and simulate the cutting path to avoid wrong cutting.
The Whole PCB Scanning Function For Editing Cutter’s Routing Path
The function of scanning the whole PCB allows the user to facilitate correcting and editing the cutter’s routing path rapidly.

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